Friday, August 12, 2016

Imaging Conference at SEMICON Europa

SEMICON Europa is to be held in Grenoble, France on October 25-26, 2016. The Imaging Conference at the event has quite an impressive image sensor agenda:

  • Drivers for Vision based Applications in the Automotive Environment
    Heinrich Gotzig, Valeo Master Expert, Valeo Schalter und Sensoren GmbH
  • The direction of CMOS image sensor evolution.
    Teruo Hirayama, Corporate Executive/ Pesident of Device & Material R&D Group, Sony Corporation
  • Camera module technologies and trends comprising assembly technologies, testing, and automation
    Kathrin Rieken, Design Engineer, Jabil Optics Germany GmbH
  • Driving by numbers
    Richard Bramley, Safety Architect, NVIDIA
  • Why image quality KPIs are a must for digital camera tuning
    Nicolas Touchard, VP Marketing, DxO Labs
  • Next Generation Human Activity Sensing For Smart Buildings
    Guillaume CROZET, VP Sales & Marketing, IRLYNX
  • Introducing vivaMOS - a CMOS image sensor spin-out from Rutherford Appleton Laboratory (RAL)
    Dan Cathie, CEO, vivaMOS Ltd
  • Enhanced features of camera modules using ultrasonic ceramic motors
    Jean-Michel Meyer, CEO, miniswys SA
  • Design strategies for low cost infrared cameras
    Guillaume DRUART, Research Scientist, ONERA
  • Is there anything beyond? Terahertz imaging: potential and perspectives
    Matteo Perenzoni, Senior Researcher, FBK
  • Democratization of optical spectroscopy for material analysis
    Damian Goldring, CTO, Consumer Physics Inc.
  • A compact, 4 channels fluorescence imaging acquisition system with no moving parts for molecular biology applications.
    Marco Bianchessi, R&I Manager, STMicroelectronics
  • Innovation in imaging on sensors, spectral filters, software and vision systems
    Maarten Willems, business director, imec
  • Analogue and Digital Pixels for Time Resolved SPAD Sensors
    Robert Henderson, Professor, University of Edinburgh
  • Neural Networks for Industry 4.0 : Analytics at the edge of the network
    Philippe LAMBINET, CEO, Cogito Instruments SA
  • Event-Driven Sensing and Processing for Vision
    Bernabe Linares-Barranco, Reseacher, CSIC
  • PRE-PROCESSING OF IMAGER DATA FOR 3D TOF IMAGING
    Beat De Coi, CEO, ESPROS Photonics AG
  • A scientific HDR Multi-spectral imaging platform
    Benoit Dupont, Business Development, Pyxalis
  • Optimization of CMOS image sensor utilizing Variable Temporal Multi-Sampling Partial Transfer Technique to Achieve Full-frame High Dynamic Range with Superior Low Light and Stop Motion Capability
    Salman Kabir, Systems Engineer, Imaging Division, Rambus
  • Zero delay Focus with poLight TLens
    Jacques Dumarest, System Principal Engineer, poLight
  • CMOS Image Sensor Scaling Enabled by Direct Bond Technology
    Paul Enquist, VP 3D R&D, Invensas
  • Advanced Wafer Level Chip Scale Packaging Solution for Industrial CMOS Image Sensors.
    Jérôme VANRUMBEKE, Profesionnal Imaging Sensors Project Manager, e2v Grenoble
  • High Dynamic Range (HDR) stereo camera system for applications in robotics
    Markus Strobel, Head of Department Vision Sensors, Institut für Mikroelektronik Stuttgart
  • Deep submicron CMOS for novel types of smart image sensors
    Peter Seitz, Adjunct professor of optoelectronics, EPFL - Institute of Microengineering

No comments:

Post a Comment

All comments are moderated to avoid spam and personal attacks.